DW-035E Zinc and Zinc Alloy Direct Electroplating Bright Acid Copper
Zinc alloy is a amphoteric metal, usually containing about 3% aluminum, and does not undergo zinc immersion treatment during the pre-treatment process, which requires higher requirements for cyanide free acidic copper plating technology. The old process of acid copper plating has a disadvantage, that is, substrates made of metals and alloys with a more negative potential than copper, such as iron, steel, zinc, tin, or die cast zinc, cannot be directly coated in these plating solutions because they must be pre coated beforehand.
The method of using DW-035E copper plating stabilizer in a plating bath that does not contain cyanide and produces a firmly adhered copper coating on zinc or zinc alloy products. And it has excellent adhesion to light. This process can provide sufficient copper deposition and corrosion resistance.
The key point in selecting the process is that it will not cause chemical reactions or replacement of zinc alloy in the plating solution, and it can also ensure the adhesion between the copper layer and the substrate, as well as between the copper layer and the intermediate coating
DW-035E copper plating stabilizer can solve the problems of complex copper plating process and poor adhesion, achieving the effect of simple process, low porosity, and good adhesion
Copper sulfate 150-200g/l
Sulfuric acid 25-50g/l
DW-035E copper plating stabilizer 10-30g/l
Current density: 0.5-2.5A/dm2
Electroplating time: 0.5-15 minutes
technological process:
(1) Wax removal: Ultrasonic wax removal
(2) Oil removal: Wash the oil removal liquid with water
(3) Activation: DW-101 Zinc Alloy Activated Acid Salt Water Wash
(4) DW-035E Zinc Alloy Direct Electroplating Bright Acid Copper Washing
(5) Electroplating water washing in bright nickel bath
(6) Chromium plating rinse and dry the component.
Zinc alloy is a amphoteric metal, usually containing about 3% aluminum, and does not undergo zinc immersion treatment during the pre-treatment process, which requires higher requirements for cyanide free acidic copper plating technology. The old process of acid copper plating has a disadvantage, that is, substrates made of metals and alloys with a more negative potential than copper, such as iron, steel, zinc, tin, or die cast zinc, cannot be directly coated in these plating solutions because they must be pre coated beforehand.
The method of using DW-035E copper plating stabilizer in a plating bath that does not contain cyanide and produces a firmly adhered copper coating on zinc or zinc alloy products. And it has excellent adhesion to light. This process can provide sufficient copper deposition and corrosion resistance.
The key point in selecting the process is that it will not cause chemical reactions or replacement of zinc alloy in the plating solution, and it can also ensure the adhesion between the copper layer and the substrate, as well as between the copper layer and the intermediate coating
DW-035E copper plating stabilizer can solve the problems of complex copper plating process and poor adhesion, achieving the effect of simple process, low porosity, and good adhesion
Copper sulfate 150-200g/l
Sulfuric acid 25-50g/l
DW-035E copper plating stabilizer 10-30g/l
Current density: 0.5-2.5A/dm2
Electroplating time: 0.5-15 minutes
technological process:
(1) Wax removal: Ultrasonic wax removal
(2) Oil removal: Wash the oil removal liquid with water
(3) Activation: DW-101 Zinc Alloy Activated Acid Salt Water Wash
(4) DW-035E Zinc Alloy Direct Electroplating Bright Acid Copper Washing
(5) Electroplating water washing in bright nickel bath
(6) Chromium plating rinse and dry the component.
