Zinc alloy cyanide free bright copper electroplating process DW-035E
DW-035E is specially formulated for zinc die-casting/magnesium zinc alloy in barrel rolling and electroplating processes.
The DW-035E process does not need to be carried out like other chemical agents. In the existing alkaline non cyanide process, barrel electroplating of galvanized die castings has always been a challenge. DW-035E can directly apply copper coating to galvanized die-casting parts in barrel and hanging electroplating processes.
It eliminates the necessity of coating in copper cyanide. A bath serves as both a plating bath and an electroplating bath.
DW-035E eliminates potential health and environmental responsibilities as well as the high cost of handling cyanide.
DW-035E copper plating solution can form a fine-grained, smooth, dense, and well ductile copper deposition layer, which is pore free and has excellent bonding properties. The coating can be easily polished to achieve high gloss.
It has excellent throwing and covering power, especially in low current areas, and is superior to copper cyanide in these performance aspects. It is used as a pre coating for nickel, tin, solder, and silver coatings.
It does not contain strong chelating agents. It will not have a negative impact on typical waste disposal systems. DW-035E copper bath is stable and does not require regular discharge and replenishment like other non cyanide alkaline copper processes based on pyrophosphate.
DW-035E is supplied in powder form. Tap water can be used to prepare the bath solution, but deionized water or soft water is preferred. Compared to other processes, simply adding one additive can easily control its performance.
Process specifications:
CuSO4 · 5HO: 20-50g/l, optimal 30
DW-035E Zinc Alloy Direct Copper Plating Additive: 30-60g/l Optimal 50
PH:5.5-7
t = 0.5-20 min
Temperature: 15-40 ° C
Current density: 0.5-3A/dm2
Measurement recommendation: Use an ampere hour controlled pump to add DW-035E
If the concentration of copper metal in the plating solution increases, add it simultaneously according to the process
DW-035E is specially formulated for zinc die-casting/magnesium zinc alloy in barrel rolling and electroplating processes.
The DW-035E process does not need to be carried out like other chemical agents. In the existing alkaline non cyanide process, barrel electroplating of galvanized die castings has always been a challenge. DW-035E can directly apply copper coating to galvanized die-casting parts in barrel and hanging electroplating processes.
It eliminates the necessity of coating in copper cyanide. A bath serves as both a plating bath and an electroplating bath.
DW-035E eliminates potential health and environmental responsibilities as well as the high cost of handling cyanide.
DW-035E copper plating solution can form a fine-grained, smooth, dense, and well ductile copper deposition layer, which is pore free and has excellent bonding properties. The coating can be easily polished to achieve high gloss.
It has excellent throwing and covering power, especially in low current areas, and is superior to copper cyanide in these performance aspects. It is used as a pre coating for nickel, tin, solder, and silver coatings.
It does not contain strong chelating agents. It will not have a negative impact on typical waste disposal systems. DW-035E copper bath is stable and does not require regular discharge and replenishment like other non cyanide alkaline copper processes based on pyrophosphate.
DW-035E is supplied in powder form. Tap water can be used to prepare the bath solution, but deionized water or soft water is preferred. Compared to other processes, simply adding one additive can easily control its performance.
Process specifications:
CuSO4 · 5HO: 20-50g/l, optimal 30
DW-035E Zinc Alloy Direct Copper Plating Additive: 30-60g/l Optimal 50
PH:5.5-7
t = 0.5-20 min
Temperature: 15-40 ° C
Current density: 0.5-3A/dm2
Measurement recommendation: Use an ampere hour controlled pump to add DW-035E
If the concentration of copper metal in the plating solution increases, add it simultaneously according to the process
